EXB841 is a ZIP-13 package manufactured by FUJI. It is a surface-mount package that is used for the mounting of semiconductor devices. It is suitable for applications such as power transistors, power MOSFETs, and IGBTs. The package has a lead pitch of 1.27mm and a body size of 6.5mm x 6.5mm. It features a low profile and a high heat dissipation capability, making it suitable for high power applications.(For reference only)
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